Adhesion method, adhesion-structure, and adhesion kit

ABSTRACT

An adhesion method including: a step (1), disposing a stickable-curable adhesive layer on a first adherend; a step (2), disposing a curing agent layer on a second adherend, the curing agent layer being able to cure the stickable-curable adhesive layer by contacting and reacting with the stickable-curable adhesive layer; and a step (3), bringing the stickable-curable adhesive layer into contact with the curing agent layer so that they are sandwiched by the first adherend and the second adherend.

RELATED APPLICATIONS AND INCORPORATION BY REFERENCE

This application is a Divisional of U.S. patent application Ser. No.15/773,586 filed May 4, 2018, which was filed pursuant to 35 U.S.C. §371 as a U.S. National Phase application of International PatentApplication No. PCT/JP2016/082327 filed Oct. 31, 2016, claiming thebenefit of priority to Japanese Patent Application No. 2015-219748 filedNov. 9, 2015. The International Application was published as WO2017/082106 on May 18, 2017. The contents of each of the aforementionedpatent applications are herein incorporated by reference in theirentirety.

TECHNICAL FIELD

The present invention relates to an adhesion method, anadhesion-structure, and an adhesion kit. In particular, the presentinvention relates to an adhesion method, an adhesion-structure in whichthe adhesion method is used, and an adhesion kit used for the adhesionmethod.

BACKGROUND ART

Conventionally, a method for using a 2-component adhesive is a knownadhesion method, in which two components of a main component (Acomponent) and a curing agent (B component) are mixed and used (forexample, see Patent Document 1 below).

In the adhesion method described in Patent Document 1, the maincomponent and the curing agent are weighed individually immediatelybefore use, and they are mixed to prepare a mixture liquid. The mixtureliquid is applied on a resin plate to form a coating, and the resinplate is bonded to another resin plate with the coating interposedtherebetween.

Thereafter, in the coating, the main component reacts with the curingagent, and the main component is cured, thereby allowing the two resinplates to adhere strongly.

CITATION LIST Patent Document

-   Patent Document 1: Japanese Unexamined Patent Publication No.    2000-336333

SUMMARY OF THE INVENTION Problem to be Solved by the Invention

However, in the adhesion method using the two-component adhesivedescribed in Patent Document 1, the main component and the curing agenthave to be individually weighed immediately before use, and mixed.Therefore, there are disadvantages in that the processes arecomplicated.

An object of the present invention is to provide an adhesion method, bywhich a first adherend can be adhered to the second adherend easily andstrongly; an adhesion-structure in which the first adherend is adheredto a second adherend by the adhesion method; and an adhesion kit usedfor the adhesion method.

Means for Solving the Problem

The present invention [1] includes an adhesion method including a step(1), disposing a stickable-curable adhesive layer on a first adherend, astep (2), disposing a curing agent layer on a second adherend, thecuring agent layer being able to cure the stickable-curable adhesivelayer by contacting and reacting with the stickable-curable adhesivelayer, and a step (3), bringing the stickable-curable adhesive layerinto contact with the curing agent layer so that they are sandwiched bythe first adherend and the second adherend.

With the adhesion method, in step (1), the stickable-curable adhesivelayer is disposed on the first adherend, and in step (2), the curingagent layer is disposed on the second adherend, and in step (3), thestickable-curable adhesive layer is brought into contact with the curingagent layer so that they are sandwiched by the first adherend and thesecond adherend, and therefore the first adherend can be adhered to thesecond adherend easily and strongly without weighing the main componentand the curing agent individually and mixing them like the adhesionmethod in Patent Document 1.

The present invention [2] includes the adhesion method of [1] above,wherein the stickable-curable adhesive layer has a peel adhesion of1.0N/20 mm or more, when the stickable-curable adhesive layer is bondedto an aluminum plate and peeled off from the aluminum plate at 90degrees and a speed of 300 mm/min.

With the adhesion method, the stickable-curable adhesive layer has apeel adhesion of the above-described lower limit or more, and thereforethe stickable-curable adhesive layer has excellent pressure-sensitiveadhesion.

The present invention [3] includes the adhesion method of theabove-described [1] or [2], wherein a cured layer is formed by reactionbetween the stickable-curable adhesive layer and the curing agent layer,the cured layer has a lap-shear adhesion of 1.0 MPa or more, and thelap-shear adhesion is measured by the following test:

Test: the stickable-curable adhesive layer is sandwiched by twopolyethylene terephthalate films that were subjected to releasetreatment, and left at room temperature for one day. Thereafter, one ofthe polyethylene terephthalate films is peeled off from thestickable-curable adhesive layer, and the peeled stickable-curableadhesive layer is disposed on a first slate plate, and thereafter, theother of the polyethylene terephthalate films is peeled off from thestickable-curable adhesive layer. Separately, the curing agent layer isdisposed on a second slate plate. Then, the stickable-curable adhesivelayer is brought into contact with the curing agent layer so that theyare sandwiched by the first slate plate and the second slate plate, andallowed to stand for 24 hours to form a cured layer, and thereafter, thefirst slate plate and the second slate plate are pulled in the sheardirection at a speed of 5 mm/min, and the strength at the time when thetwo slate plates peeled off is defined as lap-shear adhesion.

With the adhesion method, the cured layer has a lap-shear adhesion ofthe above-described lower limit or more, and therefore the firstadherend can be adhered to the second adherend even more strongly.

The present invention [4] includes the adhesion method of any one theabove-described [1] to [3], wherein the curing agent layer contains 10mass % or more of the curing agent.

With the adhesion method, the curing agent layer contains the curingagent of the above-described lower limit or more, and therefore thefirst adherend can be adhered to the second adherend even more strongly.

The present invention [5] includes the adhesion method of any one of theabove-described [1] to [4], wherein the stickable-curable adhesive layercontains epoxy resin as a main component.

With the adhesion method, the stickable-curable adhesive layer containsepoxy resin as the main component, and therefore the first adherend canbe adhered to the second adherend strongly.

The present invention [6] includes the adhesion method of any one of theabove-described [1] to [5], wherein in step (3), the stickable-curableadhesive layer is cured at normal temperature.

With the adhesion method, in step (3), the stickable-curable adhesivelayer is cured at normal temperature, and therefore heating for curingthe stickable-curable adhesive layer is unnecessary, and the firstadherend can be adhered to the second adherend even more easily.

The present invention [7] includes an adhesion kit including astickable-curable adhesive layer, and a curing agent layer, wherein thecuring agent layer is capable of curing the stickable-curable adhesivelayer by contacting and reacting with the stickable-curable adhesivelayer.

With the adhesion kit, by bringing the stickable-curable adhesive layerinto contact with the curing agent layer so that they are sandwiched bythe first adherend and the second adherend, the first adherend can beadhered to the second adherend easily and strongly.

The present invention [8] includes an adhesion-structure including afirst adherend, a second adherend disposed to face the first adherend,and a cured layer sandwiched by the first adherend and the secondadherend, wherein the cured layer is made by reaction between thestickable-curable adhesive layer and the curing agent layer.

With the adhesion-structure, the first adherend is strongly adhered tothe second adherend by the cured layer.

Effects of the Invention

With adhesion method of the present invention, the first adherend can beadhered to the second adherend strongly with an easy method of bringingthe stickable-curable adhesive layer into contact with the curing agentlayer.

With the adhesion kit of the present invention, the first adherend canbe adhered to the second adherend easily and strongly.

The adhesion-structure of the present invention includes the cured layerformed by reaction of the stickable-curable adhesive layer and thecuring agent layer disposed to be sandwiched by the first adherend andthe second adherend, and therefore the first adherend can be stronglyadhered to the second adherend.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A and FIG. 1B are process diagrams illustrating an embodiment ofthe adhesion method of the present invention, FIG. 1A illustrating astep (1) of disposing the stickable-curable adhesive layer on the firstadherend, a step (2) of disposing the curing agent layer on the secondadherend, and FIG. 1B illustrating a step (3) of bringing thestickable-curable adhesive layer into contact with the curing agentlayer so that they are sandwiched by the first adherend and the secondadherend.

FIG. 2A to FIG. 2D are process diagrams illustrating the embodimentshown in FIG. 1A and FIG. 1B in detail, FIG. 2A showing a step ofpreparing the stickable-curable adhesive layer and the curing agentcomponent, FIG. 2B showing a step of transferring the stickable-curableadhesive layer to the first adherend, FIG. 2C showing a step of applyingthe curing agent component to the second adherend, and FIG. 2D showing astep of placing the first adherend on the second adherend.

FIG. 3A to FIG. 3C are process diagrams illustrating a modifiedembodiment example of the embodiment shown in FIG. 1A and FIG. 1B, FIG.3A illustrating a step (1) of disposing the stickable-curable adhesivelayer on the first adherend, FIG. 3B illustrating a step of disposingthe curing agent layer on the stickable-curable adhesive layer, and FIG.3C illustrating a step (3) of disposing the second adherend to thecuring agent layer.

DESCRIPTION OF THE EMBODIMENTS 1. Embodiment of Adhesion Method

An embodiment of the adhesion method of the present invention isdescribed with reference to FIG. 1A and FIG. 1B.

The adhesion method includes a step (1)(ref: FIG. 1A) in which thestickable-curable adhesive layer 1 is disposed on the first adherend 2,a step (2)(ref: FIG. 1A) in which the curing agent layer 3 is disposedon the second adherend 4, the curing agent layer 3 capable of curing thestickable-curable adhesive layer 1 by making contact and reacting withthe stickable-curable adhesive layer 1, and a step (3)(ref: FIG. 1B) inwhich the stickable-curable adhesive layer 1 is brought into contactwith the curing agent layer 3 so that they are sandwiched by the firstadherend 2 and the second adherend 4.

Each step is described in the following.

1-1. Step (1)

In step (1), as shown in FIG. 1A, the stickable-curable adhesive layer 1is disposed on the first adherend 2.

The stickable-curable adhesive layer 1 is a layer (sheet) that is curedby making contact and reacting with the curing agent layer 3; extends ina surface direction (direction perpendicular to thickness direction);and has a substantially flat plate shape having flat top surface andbottom surface.

To dispose the stickable-curable adhesive layer 1 on the first adherend2, for example, first, the stickable-curable adhesive layer 1 is formedon the surface of a release film 10.

To form the stickable-curable adhesive layer 1 on the surface of therelease film 10, first, the stickable-curable adhesive composition isprepared.

The stickable-curable adhesive composition is not particularly limitedas long as it is a main component of the two-component adhesive and itcan form a layer, and examples thereof include a silicone compound;polyol compounds such as polypropylene glycol; urethane resin; and epoxyresin. The stickable-curable adhesive composition preferably containsepoxy resin as the main component. The first adherend 2 can be allowedto adhere to the second adherend 4 easily and strongly.

Examples of the epoxy resin include bisphenol epoxy resin such asbisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol S epoxyresin, and hydrogenated bisphenol A epoxy resin; naphthalene epoxyresin; biphenyl epoxy resin; dicyclo epoxy resin; alicyclic epoxy resin;triglycidylisocyanurate epoxy resin; hydantoin epoxy resin; glycidylether epoxy resin; and glycidylamino epoxy resin.

For the epoxy resin, preferably, bisphenol epoxy resin, more preferablybisphenol A epoxy resin is used.

The epoxy resin can be used singly, or can be used in combination of twoor more.

The epoxy resin can be any of liquid, semi-solid, or solid under normaltemperature, but preferably, a semi-solid epoxy resin is used singly, ora liquid epoxy resin and a solid epoxy resin are used in combination. Alayered and tacky stickable-curable adhesive layer 1 can be formed fromthe stickable-curable adhesive composition reliably in this manner.

The liquid epoxy resin under normal temperature is, specifically, isliquid at 25° C. The liquid epoxy resin has a viscosity of, under 25°C., for example, 30 Pa·s or more, preferably 80 Pa·s or more, and forexample, 500 Pa·s or less, preferably 300 Pa·s or less.

The epoxy resin that is solid under normal temperature is solid,specifically under 25° C. The solid epoxy resin has a softening pointof, for example, 70° C. or more, preferably 75° C. or more.

The blending ratio of the liquid epoxy resin relative to the solid epoxyresin (liquid epoxy resin/solid epoxy resin) is, for example, 1.0 ormore, preferably 1.5 or more, and for example, 4.0 or less, preferably3.0 or less.

When the blending ratio of the liquid epoxy resin relative to the solidepoxy resin is the above-described lower limit or more, the viscosity ofthe stickable-curable adhesive composition can be reduced to preventcoating unevenness, and homogenous stickable-curable adhesive layer 1can be produced. When the blending ratio of the liquid epoxy resinrelative to the solid epoxy resin is the above-described upper limit orless, tacky and layered stickable-curable adhesive layer can beproduced.

The blending ratio of the epoxy resin is set in the stickable-curableadhesive composition so that the epoxy resin is the main component,specifically, relative to the stickable-curable adhesive composition,for example, 80 mass % or more, preferably 90 mass % or more, and forexample, 100 mass % or less.

Preferably, the stickable-curable adhesive composition consists of epoxyresin. That is, 100 mass % of the epoxy resin is blended relative to thestickable-curable adhesive composition.

As necessary, an acrylic polymer can be blended to the stickable-curableadhesive composition.

The cohesive force of the stickable-curable adhesive composition can beimproved in this manner.

The acrylic polymer can be produced by allowing a monomer componentcontaining (meth)acrylate to react.

Examples of the (meth)acrylate include alkylmethacrylate and/oralkylacrylate, and to be specific, alkyl (meth)acrylate having 1 to 20carbon atoms including methyl (meth)acrylate, ethyl (meth)acrylate,propyl (meth)acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate,isobutyl (meth)acrylate, s-butyl (meth)acrylate, t-butyl (meth)acrylate,n-butyl (meth)acrylate, pentyl (meth)acrylate, isopentyl (meth)acrylate,hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate,2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, nonyl(meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl(meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate, tridecyl(meth)acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate,hexadecyl (meth)acrylate, heptadecyl (meth)acrylate, octadecyl(meth)acrylate, nonadecyl (meth)acrylate, and eicosyl (meth)acrylate.

For the (meth)acrylate, preferably, alkyl (meth)acrylate having 2 to 14carbon atoms, more preferably, alkyl (meth)acrylate having 4 to 9 carbonatoms are used.

(Meth)acrylate can be used singly, or can be used in combination of twoor more.

The (meth)acrylate is blended in an amount of, relative to the monomercomponent, for example, 70 mass % or more, preferably 80 mass % or more,and for example, 99 mass % or less, preferably 98 mass % or less.

The monomer component can further contain a copolymerizable monomer thatis copolymerizable with (meth)acrylate.

Examples of the copolymerizable monomer include carboxylgroup-containing monomer including (meth) acrylic acid, itaconic acid,maleic acid, crotonic acid, and maleic anhydride, and acid anhydridethereof; hydroxyl group-containing (meth)acrylate such as 2-hydroxyethyl(meth)acrylate and 3-hydroxypropyl (meth)acrylate; amidegroup-containing monomer including (meth) acrylamide, N,N-dimethyl(meth) acrylamide, N-methylol (meth) acrylamide, N-methoxymethyl (meth)acrylamide, and N-butoxymethyl (meth) acrylamide; vinyl esters such asvinyl acetate; aromatic vinyl compounds such as styrene andvinyltoluene; (meth) acrylonitrile; N-(meth) acryloylmorpholine; andN-vinyl-2-pyrrolidone.

For the copolymerizable monomer, preferably, carboxyl group-containingmonomer, hydroxyl group-containing (meth)acrylate, more preferably(meth) acrylic acid, and 2-hydroxyethyl (meth)acrylate are used.

These copolymerizable monomers can be used singly, or can be used incombination of two or more. Preferably, the carboxyl group-containingmonomer and the hydroxyl group-containing (meth)acrylate are used incombination, more preferably, (meth) acrylic acid and 2-hydroxyethyl(meth)acrylate are used in combination.

The blending ratio of the copolymerizable monomer relative to 100 partsby mass of the (meth)acrylate is, for example, 0.1 parts by mass ormore, preferably 0.3 parts by mass or more, and for example, 15 parts bymass or less, preferably 10 parts by mass or less.

To allow the monomer component to react, for example, (meth)acrylate isblended with, as necessary, the copolymerizable monomer to prepare amonomer component, and the monomer component is subjected to a knownpolymerization method, such as, for example, solution polymerization,bulk polymerization, emulsion polymerization, and various radicalpolymerization.

For the polymerization method, preferably, solution polymerization isused.

In solution polymerization, for example, the monomer component and thepolymerization initiator is blended with a solvent to prepare a monomersolution, and thereafter, the monomer solution is heated.

Examples of the solvent include organic solvent. Examples of the organicsolvent include aromatic solvents such as toluene, benzene, and xylene;ether solvents such as ethyl acetate; ketone solvents such as acetoneand methyl ethyl ketone; ester solvents such as ethyl acetate; amidesolvents such as N,N-dimethylformamide. The solvent can be used singly,or two or more solvents can be used in combination, and preferably anaromatic solvent and an ether solvent can be used in combination. Theblending ratio of the solvent relative to 100 parts by mass of themonomer component is, for example, 10 parts by mass or more, preferably50 parts by mass or more, and for example, 1000 parts by mass or less,preferably 500 parts by mass or less.

Examples of the polymerization initiator include peroxide polymerizationinitiator and azo polymerization initiator.

Examples of the peroxide polymerization initiator include organicperoxides such as peroxycarbonate, ketoneperoxide, peroxyketal,hydroperoxide, dialkylperoxide, diacylperoxide, and peroxyester.

Examples of the azo polymerization initiator include azo compounds suchas 2,2′-azobisisobutyronitrile, 2,2′-azobis(2-methylbutyronitrile),2,2′-azobis(2,4-dimethylvaleronitrile), and 2,2′-azobis dimethylisobutyrate.

For the polymerization initiator, preferably, azo polymerizationinitiators are used.

The blending ratio of the polymerization initiator relative to 100 partsby mass of the monomer component is, for example, 0.01 parts by mass ormore, preferably 0.05 parts by mass or more, and for example, 5 parts bymass or less, preferably 3 parts by mass or less.

The heating temperature is, for example, 50° C. or more, and 80° C. orless, and the heating time is, for example, 1 hour or more, and 24 hoursor less.

In this manner, the monomer component is polymerized, and an acrylicpolymer solution containing acrylic polymer is produced.

The acrylic polymer solution is blended with epoxy resin so that theacrylic polymer is, for example, 20 parts by mass or more, preferably 30parts by mass or more, and for example, 90 parts by mass or less,preferably 80 parts by mass or less relative to 100 parts by mass of thestickable-curable adhesive composition. The acrylic polymer is blendedin an amount of, relative to 100 parts by mass of the epoxy resin, forexample, 50 parts by mass or more, preferably 150 parts by mass or more,more preferably 200 parts by mass or more, and for example, 300 parts bymass or less, preferably 250 parts by mass or less.

When the blending ratio of the acrylic polymer is the above-describedlower limit or more, cohesive force, and furthermore, pressure-sensitiveadhesion of the stickable-curable adhesive composition can be improved,and peel adhesion of the stickable-curable adhesive layer 1 can beimproved.

When the blending ratio of the acrylic polymer is the above-describedupper limit or less, curing can be achieved.

To the stickable-curable adhesive composition, a trace amount of acuring agent can also be blended.

This allows for improvement in cohesive force of the stickable-curableadhesive layer 1.

Examples of the curing agent are shown later.

The blending ratio of the curing agent is adjusted so as to achieveimprovement in peel adhesion of the stickable-curable adhesive layer 1,and to achieve slight curing (not completely cured) of thestickable-curable adhesive composition. The blending ratio of the curingagent relative to 100 parts by mass of the epoxy resin is, to bespecific, 0.05 parts by mass or more, preferably 0.15 parts by mass ormore, and for example, 5 parts by mass or less, preferably 3 parts bymass or less. When the curing agent is an imidazole compound to bedescribed later, the curing agent is blended in an amount relative to100 parts by mass of the epoxy resin of, to be specific, 0.05 parts bymass or more, preferably 0.15 parts by mass or more, and for example, 5parts by mass or less, preferably 3 parts by mass or less. When thecuring agent is an amine compound to be described later, relative to 100parts by mass of the epoxy resin, the curing agent is blended in anamount of, for example, 30 parts by mass or less, preferably 15 parts bymass or less, more preferably 10 parts by mass or less.

When the blending ratio of the curing agent is the above-described lowerlimit or more, peel adhesion of the stickable-curable adhesive layer 1can be improved. When the blending ratio of the curing agent is theabove-described upper limit or less, complete curing of thestickable-curable adhesive layer 1 can be suppressed, reduction inreactivity between the stickable-curable adhesive layer 1 and the curingagent layer 3 can be suppressed, and the cured layer 5 to be describedlater can be formed reliably.

To produce the stickable-curable adhesive composition, for example,epoxy resin is blended with, as necessary, an acrylic polymer (acrylicpolymer solution) and/or a curing agent, and as necessary, the mixtureis diluted with a solvent to prepare a varnish.

The solvent is not limited as long as it can dissolve thestickable-curable adhesive composition, and for example, theabove-described solvents can be used. For the solvent, preferably,ketone solvent is used.

The varnish has a stickable-curable adhesive composition concentrationof, for example, 20 mass % or more, preferably 40 mass % or more, andfor example, 80 mass % or less, preferably 70 mass % or less.

When an acrylic polymer is blended into the stickable-curable adhesivecomposition, a cross-linking agent can be blended when thestickable-curable adhesive composition is prepared.

Examples of the cross-linking agent include an isocyanate cross-linkingagent, an aziridine cross-linking agent, an epoxy cross-linking agent,and a metal chelate cross-linking agent, and preferably, an isocyanatecross-linking agent is used.

Examples of the isocyanate cross-linking agent include aromaticdiisocyanates such as tolylene diisocyanate and xylenediisocyanate;alicyclic diisocyanates such as isophoronediisocyanate; aliphaticdiisocyanates such as hexamethylene diisocyanate; and modified productof these isocyanates (to be specific, tolylene diisocyanate adduct oftrimethylolpropane, etc).

For the cross-linking agent, preferably, modified products of isocyanateare used.

The cross-linking agent is blended in an amount of, relative to 100parts by mass of the acrylic polymer, for example, 1 part by mass ormore, preferably 5 parts by mass or more, and for example, 20 parts bymass or less, preferably 15 parts by mass or less.

The stickable-curable adhesive composition is prepared in this manner.

Thereafter, the stickable-curable adhesive composition is applied on thesurface of the release film 10, and thereafter, dried.

The release film 10 is, for example, a substantially rectangularflat-plate-shaped release sheet, and is formed into a shape having aflat top face and a flat bottom face.

The release film 10 is formed into a film from resin materials such asvinyl polymers including polyolefins (to be specific, polyethylene,polypropylene) and ethylene-vinyl acetate copolymer (EVA); polyestersincluding polyethylene terephthalate and polycarbonate; and fluorineresin including polytetrafluoroethylene. The release film 10 also can beformed from metal materials such as iron, aluminum, and stainless steel.

For the release film 10, preferably, polyester film, more preferably,polyethylene terephthalate film is used.

The surface of the release film 10 can be subjected to, as necessary,treatment for release.

The release film 10 has a thickness of, for example, 10 μm or more, and1000 μm or less.

Examples of the application method include doctor blade method, rollmethod, screen method, and gravure method.

The heating conditions are as follows: the heating temperature is, forexample, 70° C. or more, and 130° C. or less. The heating time is, forexample, 1 minute or more and 5 minutes or less.

When the stickable-curable adhesive composition contains thecross-linking agent, the acrylic polymer is crosslinked by thecross-linking agent with further heating after the above-describedheating. The temperature in the further heating is, 30° C. or more, and60° C. or less, and the time is, for example, 1 hour or more, preferably1 day or more.

When the stickable-curable adhesive composition contains the curingagent, the heating temperature is 70° C. or more, and 160° C. or less,and the heating time is, 5 minutes or more, and 5 hours or less. Thisallows for the entire curing agent to react with a portion of epoxyresin.

The stickable-curable adhesive layer 1 can be formed on the surface onthe release film 10 from the stickable-curable adhesive composition.

The stickable-curable adhesive layer 1 has a thickness of, for example,1 μm or more, preferably 5 μm or more, more preferably 10 μm or more,and for example, 1000 μm or less, preferably 500 μm or less, morepreferably 100 μm or less.

As necessary, another release film (not shown) can be disposed on(allowed to contact with) the surface of the stickable-curable adhesivelayer 1 (surface opposite to the contact surface where it makes contactwith the release film 10).

That is, the stickable-curable adhesive layer 1 can be sandwiched by tworelease films.

The stickable-curable adhesive layer 1 has pressure-sensitiveadhesiveness (pressure-sensitive adhesion or initial adhesive strength).

To be specific, the stickable-curable adhesive layer 1 has a peeladhesion to an aluminum plate of, for example, 1.0N/20 mm or more,preferably 2.4N/20 mm or more, and more preferably 3.0N/20 mm or more,and for example, 10N/20 mm or less.

When the stickable-curable adhesive layer 1 has a peel adhesion to thealuminum plate of the above-described lower limit or more, thestickable-curable adhesive layer 1 has excellent pressure-sensitiveadhesiveness.

The peel adhesion of the stickable-curable adhesive layer 1 isdetermined by bonding the stickable-curable adhesive layer 1 to thealuminum plate, and thereafter, the stickable-curable adhesive layer 1is peeled off from the aluminum plate at 90 degrees and at a speed of300 mm/min.

When the stickable-curable adhesive layer 1 is tested by a 24 hourconstant load test, the time it takes until the polyethyleneterephthalate film is peeled (peeling time) is, for example, 1 hour ormore, preferably 5 hours or more, and for example, 24 hours or less.

When the peeling time is the above-described lower limit or more, thestickable-curable adhesive layer 1 has excellent pressure-sensitiveadhesiveness.

The constant load test is described in Examples later on.

Thereafter, the stickable-curable adhesive layer 1 is transferred to thesurface of the first adherend 2 from the release film 10. To bespecific, first, the stickable-curable adhesive layer 1 is allowed tocontact the first adherend 2, and then as shown with the arrow in FIG.1A, the release film 10 is peeled off from the stickable-curableadhesive layer 1.

The release film 10 can also be peeled off from the stickable-curableadhesive layer 1 after step (2), immediately before the step (3).

When the stickable-curable adhesive layer 1 is sandwiched by the tworelease films, for example, first, one release film is peeled off. Then,the exposed face of the stickable-curable adhesive layer 1 is allowed tocontact the first adherend 2, and then, as shown with the arrow in FIG.1A, the release film 10 is peeled off from the stickable-curableadhesive layer 1.

The first adherend 2 is not particularly limited, and examples thereofinclude metal, glass, plastic, slate, mortar, concrete, rubber, woods,leather, fabric, and paper.

For the first adherend 2, preferably slate, mortar, or concrete is used.

In this manner, as shown in FIG. 1A, the stickable-curable adhesivelayer 1 is disposed on the first adherend 2.

1-2. Step (2)

The curing agent layer 3 is a layer (sheet) that is capable of curingthe stickable-curable adhesive layer 1 by contacting and reacting withthe stickable-curable adhesive layer 1, that extends in the surfacedirection (direction perpendicular to thickness direction), and has asubstantially flat plate shape having a flat top surface and bottomsurface.

In step (2), as shown in FIG. 1A, the curing agent layer 3 is disposedon the second adherend 4.

To dispose the curing agent layer 3 on the second adherend 4, forexample, first, the curing agent component is prepared.

The curing agent component contains a curing agent.

The curing agent is not particularly limited as long as it is a curingagent that is capable of forming a layer and is for a two-componentadhesive. When the stickable-curable adhesive composition is a siliconecompound, examples thereof include a silicone compound. When thestickable-curable adhesive composition is a polyol compound, isocyanateis used. When it is urethane resin, urethane resin curing agent is used.When epoxy resin is used, for example, epoxy resin curing agents such asan imidazole compound and an amine compound are used.

Examples of the imidazole compound include methyl imidazole,2-ethyl-4-methyl imidazole, 1-isobutyl-2-methyl imidazole,1-benzyl-2-methyl imidazole, 2-ethyl-4-methyl imidazole, ethylimidazole,isopropyl imidazole, 2,4-dimethyl imidazole, phenylimidazole,undecylimidazole, heptadecylimidazole, 2-phenyl-4-methyl imidazole,2-phenyl-4,5-dihydroxymethyl imidazole, and2-phenyl-4-methyl-5-hydroxymethyl imidazole, and preferably,1-isobutyl-2-methyl imidazole, 1-benzyl-2-methyl imidazole, and2-ethyl-4-methyl imidazole are used, more preferably,1-isobutyl-2-methyl imidazole, 1-benzyl-2-methyl imidazole, further morepreferably 1-isobutyl-2-methyl imidazole are used.

Examples of the amine compound include ethylene diamine, propylenediamine, diethylene triamine, triethylenetetramine, their amine adducts,metaphenylenediamine, diaminodiphenylmethane, and diaminodiphenylsulfone.

For the curing agent, preferably, an imidazole compound is used.

The curing agent can be used singly, or can be used in combination oftwo or more.

The curing agent is blended in an amount of, relative to the curingagent component, for example, 10 mass % or more, preferably 30 mass % ormore, more preferably 50 mass % or more, even more preferably 80 mass %or more, particularly preferably 90 mass % or more, and for example, 100mass % or less. When the blending ratio of the curing agent is theabove-described lower limit or more, the stickable-curable adhesivelayer 1 with excellent adhesion can be achieved.

Preferably, the curing agent component consists of the curing agent,that is, the percentage of the curing agent is, relative to the curingagent component, 100 mass %.

To the curing agent component, as necessary, the above-described epoxyresin can be blended.

The blending ratio of the epoxy resin relative to 100 parts by mass ofthe curing agent is, 30 parts by mass or more, preferably 40 parts bymass or more, and for example, 70 parts by mass or less, preferably 60parts by mass or less.

When the blending ratio of the epoxy resin is the above-described upperlimit or less, in step (2), reaction of substantially the entire curingagent with the epoxy resin can be prevented in the curing agent layer 3,and in step (3), reduction in reactivity of the (curing agent of) curingagent layer 3 with the (epoxy resin of) stickable-curable adhesive layer1 can be prevented.

To prepare the curing agent component, the curing agent is blended with,as necessary, epoxy resin to prepare varnish.

When the curing agent is solid, as necessary, the curing agent can bedissolved with a solvent to prepare varnish.

Those solvents that are capable of dissolving the stickable-curableadhesive composition will suffice, and for example, the above-describedsolvent can be used.

The varnish has a curing agent component concentration of, for example,10 mass % or more, preferably 20 mass % or more, and for example, 90mass % or less, preferably 50 mass % or less.

The curing agent component is prepared in this manner.

Thereafter, the curing agent component is applied on the second adherend4. To be specific, the varnish of the curing agent component is appliedon the second adherend 4.

The second adherend 4 is not particularly limited, and theabove-described adherend can be used.

The application method can be, for example, the above-described methods.

Thereafter, as necessary, excess varnish of the curing agent componenton the surface of the second adherend 4 is removed. For example, excessvarnish of the curing agent component on the surface of the secondadherend 4 is wiped off.

Then, when the varnish contains a solvent, the varnish is dried toremove the solvent.

In this manner, the curing agent layer 3 is formed on the surface of thesecond adherend 4, and the curing agent layer 3 is disposed on thesecond adherend 4.

The curing agent layer 3 has a thickness of, for example, 1 μm or more,preferably 5 μm or more, more preferably 10 μm or more, and for example,1000 μm or less, preferably 800 μm or less, more preferably 500 μm orless.

In this manner, an adhesion kit 7 including the stickable-curableadhesive layer 1 disposed on the first adherend 2 and the curing agentlayer 3 disposed on the second adherend 4 is prepared.

1-3. Step (3)

In step (3), as shown in FIG. 1B, the stickable-curable adhesive layer 1is allowed to contact the curing agent layer 3 so that they aresandwiched by the first adherend 2 and the second adherend 4.

That is, the first adherend 2 and the second adherend 4 are placed ontop of the other so that the stickable-curable adhesive layer 1 and thecuring agent layer 3 are contacting each other.

Then, the contact between the stickable-curable adhesive layer 1 and thecuring agent layer 3 causes reaction.

The reaction temperature is, for example, normal temperature.

As necessary, the stickable-curable adhesive layer 1 and the curingagent layer 3 can be heated, and the heating temperature is, forexample, 50° C. or more, preferably 70° C. or more, and for example,130° C. or less, preferably 110° C. or less.

The reaction temperature is, preferably normal temperature. The normaltemperature is, the temperature without the above-described heating (forexample, heating at 50° C. or more) for allowing the stickable-curableadhesive layer 1 and the curing agent layer 3 to react, and for example,less than 50° C., preferably 40° C. or less, and for example, 10° C. ormore, preferably 20° C. or more.

When the reaction temperature is normal temperature, heating for causingthe reaction between the stickable-curable adhesive layer 1 and thecuring agent layer 3 is not necessary, and the first adherend 2 can beadhered to the second adherend 4 even more simply.

The reaction time is, for example, 1 hour or more, preferably 12 hoursor more, and for example, 96 hours or less, preferably 48 hours or less.

The stickable-curable adhesive layer 1 is cured in this manner to be acured layer 5. Preferably, the stickable-curable adhesive layer 1 iscured at normal temperature.

In FIG. 1B, a boundary is formed between the stickable-curable adhesivelayer 1 and the curing agent layer 3, but the cured layer 5 is a layerformed by integration of and reaction between the stickable-curableadhesive layer 1 and the curing agent layer 3, and the above-describedboundary is not present.

The cured layer 5 allows the first adherend 2 and the second adherend 4to adhere to each other.

The cured layer 5 has a lap-shear adhesion of, for example, 0.1 MPa ormore, preferably 0.4 MPa or more, more preferably 0.6 MPa or more,further preferably 0.7 MPa or more, particularly preferably 1.0 MPa ormore, most preferably 2.3 MPa or more, furthermore, 2.5 MPa or more,furthermore, 3.5 MPa or more.

When the cured layer 5 has a lap-shear adhesion of the above-describedlower limit or more, the stickable-curable adhesive layer has excellentadhesion, and is capable of reliably allowing the first adherend 2 andthe second adherend 4 to adhere to each other.

The lap-shear adhesion of the cured layer 5 is measured by the followingmethod. The stickable-curable adhesive layer 1 is sandwiched by twopolyethylene terephthalate films that were subjected to releasetreatment, and they are allowed to stand at room temperature for oneday. Thereafter, one polyethylene terephthalate film is peeled off fromthe stickable-curable adhesive layer 1, and the peeled stickable-curableadhesive layer 1 is disposed on the first slate plate, and thereafter,the other polyethylene terephthalate film is peeled off from thestickable-curable adhesive layer 1. Separately, the curing agent layer 3is disposed on the second slate plate. Then, the stickable-curableadhesive layer 1 and the curing agent layer 3 are allowed to contacteach other so that they are sandwiched by the first slate plate and thesecond slate plate, and they are allowed to stand for 24 hours to form acured layer 5. Thereafter, the first slate plate and the second slateplate are pulled in the sear direction at a speed of 5 mm/min. Thestrength at which the two slate plates are peeled off is determined as alap-shear adhesion.

An adhesion-structure 6 is produced in this manner.

That is, the adhesion-structure 6 includes the first adherend 2, and thesecond adherend 4 disposed to face the first adherend 2, and the curedlayer 5 sandwiched by these.

In the adhesion-structure 6, the first adherend and the second adherendare strongly adhered to each other by the cured layer 5.

2. Operations and Effects of First Embodiment

With the adhesion method, as shown in FIG. 1A, in step (1), thestickable-curable adhesive layer 1 is disposed on the first adherend 2,in step (2), the curing agent layer 3 is disposed on the second adherend4, as shown in FIG. 1B, and in step (3), the stickable-curable adhesivelayer 1 is allowed to contact the curing agent layer 3 so that they aresandwiched by the first adherend 1 and the second adherend 4. Therefore,the first adherend 2 and the second adherend 4 are allowed to adhere toeach other easily and strongly.

That is, in this method, as shown in FIG. 2A, the stickable-curableadhesive layer 1 sandwiched by two release films 10 is prepared by theabove-described method.

Separately, the varnish of the curing agent component is prepared, andas shown in FIG. 2A, the varnish of the curing agent component is storedin the vessel 8.

In this manner, as shown in FIG. 2A, the stickable-curable adhesivelayer 1 and the curing agent component are prepared.

Then, the stickable-curable adhesive layer 1 and the curing agentcomponent are transported to a place of use.

Thereafter, one release film 10 is released, and then, as shown in FIG.2B, the stickable-curable adhesive layer 1 is transferred to the firstadherend 2 from the other release film 10.

Separately, as shown in FIG. 2C, the varnish of the curing agentcomponent is applied to the second adherend 4. To be specific, thecuring agent component is taken out from the vessel 8, and the varnishof the curing agent component is applied on the second adherend 4 by,for example, spray or brush. Then, the varnish of the curing agentcomponent penetrates into the upper end portion of the second adherend4. Thereafter, as necessary, the excess curing agent component remainedon the surface of the second adherend 4 is wiped off.

In this manner, as shown in FIG. 2C, the curing agent layer 3 composedof the curing agent component is formed on the upper end portion of thesecond adherend 4.

When the curing agent component is present on the surface of the secondadherend 4, the curing agent layer 3 (not shown) is formed by the curingagent component present on the surface of the second adherend 4 and thecuring agent component penetrated into the upper end portion of thesecond adherend 4.

Then, as shown in FIG. 2D, the first adherend 2 and the second adherend4 are placed, one on top of the other so that the stickable-curableadhesive layer 1 and the curing agent layer 3 make contact with eachother.

With the adhesion method, when peel adhesion of the stickable-curableadhesive layer 1 is the above-described lower limit or more, thestickable-curable adhesive layer 1 has excellent pressure-sensitiveadhesion (initial adhesion).

With the adhesion method, when lap-shear adhesion of the cured layer 5is the above-described lower limit or more, the first adherend 2 and thesecond adherend 4 can be allowed to adhere to each other even morestrongly.

With the adhesion method, when the curing agent layer 3 contains thecuring agent of the above-described lower limit or more, the firstadherend 2 and the second adherend 4 can be allowed to adhere to eachother even more strongly.

Furthermore, with the adhesion method, when the stickable-curableadhesive layer 1 contains epoxy resin as main component, the firstadherend 2 and the second adherend 4 can be allowed to adhere to eachother strongly.

With the adhesion method, in step (3), when the stickable-curableadhesive layer 1 is cured at normal temperature, heating for curing thestickable-curable adhesive layer 1 is unnecessary, and the firstadherend 2 and the second adherend 4 can be allowed to adhere to eachother even more simply.

With the adhesion kit 7, by allowing the stickable-curable adhesivelayer 1 and the curing agent layer 3 to contact each other so that theyare sandwiched by the first adherend 2 and the second adherend 4, thefirst adherend 2 and the second adherend 4 can be allowed to adhere toeach other easily and strongly.

With the adhesion-structure 6, the first adherend 2 and the secondadherend 4 are allowed to adhere to each other by the cured layer 5.

3. Modified Example

Modified Example of the first embodiment is described with reference toFIG. 3A to FIG. 3C.

In Modified Examples below, the members that are the same as thosedescribed above are given the same reference numerals, and detaileddescription thereof is omitted.

In the first embodiment, as shown in FIG. 1A, the stickable-curableadhesive layer 1 and the curing agent layer 3 are disposed on the firstadherend 2 and the second adherend 4, respectively, but in ModifiedExample, as shown in FIG. 3B, the stickable-curable adhesive layer 1 andthe curing agent layer 3 are disposed sequentially on the surface of thefirst adherend 2.

In Modified Example, first, as shown in FIG. 3A, the stickable-curableadhesive layer 1 is disposed on the surface of the first adherend 2.

Then, as shown in FIG. 3B, the curing agent layer 3 is disposed on thesurface of the stickable-curable adhesive layer 1.

To dispose the curing agent layer 3 on the surface of thestickable-curable adhesive layer 1, for example, the varnish of thecuring agent component is applied on the surface of thestickable-curable adhesive layer 1. Alternatively, the varnish of thecuring agent component is applied on the surface of the release sheet(not shown), and as necessary, dried. In this manner, the curing agentlayer 3 is formed on the surface of the release sheet. Thereafter, thecuring agent layer 3 is transferred on the surface of thestickable-curable adhesive layer 1 from the release sheet.

Then, as shown in FIG. 3C, the second adherend 4 is disposed on thesurface of the curing agent layer 3. In this manner, thestickable-curable adhesive layer 1 and the curing agent layer 3 aresandwiched by the first adherend 2 and the second adherend 4. Then, thecured layer 5 is formed, and this produces the adhesion-structure 6 inwhich the first adherend 2 and the second adherend 4 are adhered to eachother.

In the description above, as shown in FIG. 3B, the stickable-curableadhesive layer 1 and the curing agent layer 3 are disposed on thesurface of the first adherend 2 sequentially, but for example, althoughnot shown, the curing agent layer 3 and the stickable-curable adhesivelayer 1 can be disposed on the surface of the first adherend 2sequentially.

In the first embodiment, as shown in FIG. 1A, the adhesion kit 7includes the stickable-curable adhesive layer 1 disposed (supported) onthe first adherend 2 and the curing agent layer 3 disposed (supported)on the second adherend 4, but it is not limited thereto. That is, in theadhesion kit 7, the support for the stickable-curable adhesive layer 1and the curing agent layer 3 is not particularly limited.

That is, in the adhesion kit 7, the stickable-curable adhesive layer 1and the curing agent layer 3 both formed into layers will suffice, andfor example, the stickable-curable adhesive layer 1 and/or curing agentlayer 3 can be formed (supported) on the surface of the release film(not shown).

A plurality of stickable-curable adhesive layers 1 can be laminated toconfigure a multilayered stickable-curable adhesive layer 1.

A plurality of the curing agent layers 3 can be laminated to configure amultilayered curing agent layer 3.

EXAMPLES

In the following, the present invention is described in more detail withreference to Examples and Comparative Examples. However, the presentinvention is not limited to Examples and Comparative Examples by anymeans. The specific numerical values in blending ratio (content),physical property value, and parameter used in the following descriptioncan be replaced with upper limit values (numerical values defined with“or less” or “below”) or lower limit values (numerical values definedwith “or more” or “above”) of corresponding numerical values in blendingratio (content ratio), physical property value, and parameter describedin the above-described “DESCRIPTION OF EMBODIMENTS”.

In the following description, “part(s)” and “%” are by mass, unlessotherwise noted.

1. Production of Stickable-Curable Adhesive Layer and Preparation ofCuring Agent Component

Preparation Example 1

70 parts of liquid bisphenol A epoxy resin (trade name “jER 828”,manufactured by Mitsubishi Chemical Corporation.) and 30 parts of solidbisphenol A epoxy resin (trade name “jER 1256”, manufactured byMitsubishi Chemical Corporation.) were mixed, and methyl ethyl ketonewas added to dilute the mixture so that the concentration (liquidbisphenol A epoxy resin and solid bisphenol A epoxy resin concentration)was 60%, thereby preparing varnish. The varnish was applied on thesurface of the polyethylene terephthalate film (trade name “Diafoil MRF#38”, manufactured by Mitsubishi Plastics, Inc.) treated for release sothat its thickness after drying was 20 μm, and it was heated at 100° C.for 1 minute, thereby producing a stickable-curable adhesive layer.Thereafter, the stickable-curable adhesive layer was allowed to contactanother polyethylene terephthalate film so that the stickable-curableadhesive layer was sandwiched by two polyethylene terephthalate films.

Separately, a curing agent component was prepared in accordance with thedetails shown in Table 1.

Preparation Examples 2 to 8 and Comparative Preparation Examples 3 and 4

The stickable-curable adhesive layer and the curing agent layer wereprepared in the same manner as in Example 1, except that the blendingformulation was changed in accordance with Table 1.

Comparative Preparation Example 1

For the stickable-curable adhesive composition and the curing agentcomponent, a two-component epoxy adhesive was prepared.

Comparative Preparation Example 2

For the stickable-curable adhesive layer, an adhesive tape was prepared.

2. Evaluation

1) Sheet Moldability

The stickable-curable adhesive layer of Preparation Examples 1 to 8 andComparative Preparation Examples 1 to 4 was evaluated with the followingcriteria. Those molded into a sheet were evaluated as GOOD, and thosecould not be molded into a sheet were evaluated as BAD.

The results are shown in Table 1.

2) Peel Adhesion

The stickable-curable adhesive layer was allowed to stand at roomtemperature for one day.

Thereafter, one side of the polyethylene terephthalate film on thestickable-curable adhesive layer was released, and a polyethyleneterephthalate film (trade name “Lumirror 25S10”, manufactured by PANACCorporation) having a thickness of 25 μm was disposed on the exposedstickable-curable adhesive layer. Then, it was cut to a width of 20 mm,the other polyethylene terephthalate film was released, and the exposedstickable-curable adhesive layer was disposed on an aluminum platehaving a thickness of 2 mm After bonding, a 2-kg roller was applied oneround (back and forth) to compression bond. After 30 minutes from thebonding, peel adhesion was measured using a tensile and compressiontesting machine (device name “TG-1kN”, manufactured by Minebea Co.,Ltd.) at a peeling angle of 90° and a peeling speed of 300 mm/min.

In Comparative Preparation Example 1, the stickable-curable adhesivelayer, which was prepared using component A of the two-component epoxyadhesive, was subjected to the above-described peeling test.

In Comparative Preparation Example 2, an adhesive tape was used andsubjected to the above-described peeling test.

The results are shown in Table 1.

3) Constant Load Test

The stickable-curable adhesive layer of Preparation Examples 1 to 8 andComparative Preparation Examples 3 and 4 was allowed to stand at roomtemperature for one day.

Thereafter, one polyethylene terephthalate film of the stickable-curableadhesive layer was peeled off, and another polyethylene terephthalatefilm (trade name “Lumirror 25S10”, manufactured by PANAC) having athickness of 25 μm was disposed on the exposed stickable-curableadhesive layer. Then, it was cut into a size of a width of 20 mm×alength of 50 mm, and the other polyethylene terephthalate film (tradename “Diafoil MRF #38”, manufactured by Mitsubishi Plastics, Inc.) waspeeled off, and the exposed stickable-curable adhesive layer wasdisposed on a concrete plate (nonflammable board (Mitsubishi flexibleboard N, thickness 5 mm)). Thereafter, it was compression bonded with a2-kg hand roller. After compression bonding, a constant load (12 g) wasfixed to an end portion of the polyethylene terephthalate film. Peelingof the polyethylene terephthalate film was started with a constant loadat normal temperature (25° C.) so that the peeling angle was 90°. With agrip portion of a length of 20 mm, the time until the remaining length30 mm was all peeled off (maximum 24 hours) was measured.

In Comparative Preparation Example 1, the stickable-curable adhesivelayer prepared by using liquid A of the two-component epoxy adhesive wassubjected to the above-described constant load test.

In Comparative Preparation Example 2, an adhesive tape was used, and wassubjected to the above-described constant load test.

The results are shown in Table 1.

4) Lap-Shear Adhesion

Example 1

The stickable-curable adhesive layer of Preparation Example 1 wasallowed to stand at room temperature for one day.

Two stickable-curable adhesive layers were placed on top of the other toform a two layered stickable-curable adhesive layer having a thicknessof 40 μm. The stickable-curable adhesive layer was cut into a size ofwidth 30 mm×length 10 mm, and thereafter, one polyethylene terephthalatefilm was peeled off, and a distal end of a slate plate (JIS A 5430)having a width of 30 mm×length of 130 mm×a thickness of 3 mm wasdisposed on the exposed stickable-curable adhesive layer. Then, theother polyethylene terephthalate film was peeled off.

Separately, a curing agent component was applied on the distal end(width 30 mm×length 10 mm) of the other slate plate, and then excessliquid on the surface was wiped off, thereby forming a curing agentlayer on the surface of the other slate plate. Thereafter, the two slateplates were bonded together so that the stickable-curable adhesive layerand the curing agent layer make contact with each other, and then twoslate plates were fixed with a clip, and it was allowed to stand for 24hours. Thereafter, two slate plates were pulled with a tensile andcompression testing machine (device name “TG-5kN”, manufactured byMinebea Co., Ltd.) in a shear direction (length direction) at a peelingspeed of 5 mm/min, and testing strength at which one of the two slateplates was peeled off was measured. The lap-shear adhesion wascalculated based on the following formula.Lap-shear adhesion (MPa)=testing strength (N)/300 mm²  (1)

The results are shown in Table 1.

Examples 2 to 8

Lap-shear adhesion was measured in the same manner as in Example 1,except that the stickable-curable adhesive layer and the curing agentlayer were changed in accordance with Table 1.

The results are shown in Table 1.

Comparative Example 1

Two components were mixed in accordance with the usage method of theadhesive, and the mixture was applied on a distal end of one slate plateso that its width was 30 mm and length was 10 mm, and the distal end ofthe one slate plate was bonded to the distal end of the other slateplate, and it was fixed with a clip, and allowed to stand for 24 hours.

The results are shown in Table 1.

Comparative Example 2

A double-sided tape was cut into a size of a width of 30 mm and a lengthof 10 mm, and bonded to a distal end of one slate plate. The distal endof the slate plate was bonded to a distal end of the other slate plate,and it was fixed with a clip, and allowed to stand for 24 hours.

The results are shown in Table 1.

Comparative Example 3

Lap-shear adhesion was measured in the same manner as in Example 1,except that the stickable-curable adhesive layers were placed on top ofthe other to form a stickable-curable adhesive layer having a thicknessof 40 μm.

The results are shown in Table 1.

Comparative Example 4

Lap-shear adhesion was measured in the same manner as in Example 1,except that instead of allowing the two slate plates fixed with the clipto stand for 24 hours, it was heated at 150° C. for 20 minutes.

The results are shown in Table 1.

TABLE 1 Blending formulation of stickable-curable adhesive compositionAcrylic Cross-linking Blending formulation of curing components polymerCuring agent Concentration Heating Epoxy Epoxy resin Acrylic agentCORONATE in MEK (drying) Curing agent resin Solvent jER828 jER1256polymer IBMI12 L dilution[%] conditions IBMI12 BMI12 EMI24 ST12 jER828MEK Prep. 70 30 — — — 60 100° C. 100 — — — — — Ex. 1 1 min. Prep. 70 30— — — 60 100° C. — 100 — — — — Ex. 2 1 min. Prep. 70 30 — — — 60 100° C.— — 80 — — 20 Ex. 3 1 min. Prep. 70 30 — — — 60 100° C.  50 — — — 50 —Ex. 4 1 min. Prep. 70 30 — — — 60 100° C.  20 — — — — 80 Ex. 5 1 min.Prep. 70 30 — — — 60 100° C. — — — 100 — — Ex. 6 1 min. Prep. 70 30 —0.1 — 60 150° C. 100 — — — — — Ex. 7 20 min. Prep. 21  9 70 — 7 35 120°C. 100 — — — — — Ex. 8 3 min. →40° C. 3 days Comp Component A oftwo-component Component A of .Prep. epoxy adhesive two-component Ex. 1epoxy adhesive Comp Pressure-sensitive adhesive tape — Prep. Ex. 2 Comp70 30 — — — 60 100° C. No curing agent layer Prep. 1 min. Ex. 3 Comp 7030 — 3 — 60 100° C. Prep. 1 min. Ex. 4 Stickable- Pressure-sensitiveadhesion curable Peel adhesive layer Adhesion Sheet adhesion Constantand curing Curing Lap-shear moldability [N/20 mm] load test [time] agentlayer conditions adhesion [MPa] Prep. GOOD 3.7 4 Ex. 1 Normal 3.86 Ex. 1Temp Prep. GOOD 3.7 4 Ex. 2 Normal 3.49* Ex. 2 Temp Prep. GOOD 3.7 4 Ex.3 Normal 0.66 Ex. 3 Temp Prep. GOOD 3.7 4 Ex. 4 Normal 2.48 Ex. 4 TempPrep. GOOD 3.7 4 Ex. 5 Normal 4.09* Ex. 5 Temp Prep. GOOD 3.7 4 Ex. 6Normal 0.57 Ex. 6 Temp Prep. GOOD 2.2 No Ex. 7 Normal 2.28 Ex. 7 peelingTemp Prep. GOOD 2.5 No Ex. 8 Normal 0.34 Ex. 8 peeling Temp Comp. BADUnable to Unable to Comp. Normal 3.80 Prep. measure measure Ex. 1 TempEx. 1 Comp. GOOD 10 No Comp. No 0.71 Prep. peeling Ex. 2 curing Ex. 2Comp. GOOD 3.7 4 Comp. No 0.04 Prep. Ex. 3 curing Ex. 3 Comp. GOODUnable to Unable to Comp. Heating Unable to Prep. measure measure Ex. 4measure Ex. 4 *Material failure

In Table 1, the values in the blending formulation column are by partsby mass.

Abbreviations used in Table 1 are described below.

jER 828: bisphenol A epoxy resin, normal temperature (25° C.) liquid,viscosity (25° C.) 120 Pa·s to 150 Pa·s, manufactured by MitsubishiChemical Corporation.

jER 1256: high molecular weight bisphenol A epoxy resin, normaltemperature (25° C.) solid, softening point 85° C., manufactured byMitsubishi Chemical Corporation.

Acrylic Polymer:

The acrylic polymer was prepared by the following procedures.

A four-neck flask equipped with a stirring blade, a thermometer, anitrogen gas inlet tube, and a condenser was charged with 100 parts ofn-butylacrylate, 0.1 parts of 2-hydroxyethylacrylate, 3 parts of acrylicacid, 0.1 parts of 2,2′-azobisisobutyronitrile as a polymerizationinitiator, 100 parts of ethyl acetate, and 100 parts of toluene, andnitrogen gas was introduced while gently stirring the mixture, therebyconducting nitrogen replacement for 1 hour. Thereafter, polymerizationreaction was performed for 15 hours while keeping the liquid temperaturein the flask at around 55° C., thereby preparing an acrylic polymersolution having a weight-average molecular weight of 60 million.

CORONATE L: isocyanate cross-linking agent

IBMI 12: 1-isobutyl-2-methyl imidazole, normal temperature liquid,manufactured by Mitsubishi Chemical Corporation.

BMI 12: 1-benzyl-2-methyl imidazole, normal temperature liquid,manufactured by Mitsubishi Chemical Corporation.

EMI 24: 2-ethyl-4-methyl imidazole, normal temperature solid,manufactured by Mitsubishi Chemical Corporation.

ST12: amine curing agent, manufactured by Mitsubishi ChemicalCorporation.

MEK: methyl ethyl ketone

Two-component epoxy adhesive: trade name “High Super 5”, manufactured byCEMEDINE Co., ltd.

Adhesive tape: trade name “No. 5000NS”, manufactured by Nitto DenkoCorporation

While the illustrative embodiments of the present invention are providedin the above description, such is for illustrative purpose only and itis not to be construed restrictively. Modification and variation of thepresent invention that will be obvious to those skilled in the art is tobe covered by the following claims.

INDUSTRIAL APPLICABILITY

The adhesion method of the present invention is used for production ofan adhesion-structure.

DESCRIPTION OF REFERENCE NUMERALS

-   -   1 stickable-curable adhesive layer    -   2 first adherend    -   3 curing agent layer    -   4 second adherend    -   5 cured layer    -   6 adhesion-structure    -   7 adhesion kit

The invention claimed is:
 1. An adhesion kit comprising: apressure-sensitive adhesive layer comprising a curable adhesive on afirst adherend, and a curing agent layer comprising a solvent-freevarnish of a curing agent component consisting of a curing agent,wherein the solvent-free varnish is directly on a second adherend,wherein the curing agent layer is capable of curing the curable adhesiveby contacting and reacting with the curable adhesive.
 2. Anadhesion-structure comprising: a first adherend, a second adherenddisposed to face the first adherend, and a cured layer sandwiched by thefirst adherend and the second adherend, wherein the cured layer is madeby a reaction between a pressure-sensitive adhesive layer comprising acurable adhesive layer that is on one of the first adherend or thesecond adherend and a curing agent layer comprising a solvent-freevarnish of a curing agent component consisting of a curing agent that isdirectly on the other of the first adherend or the second adherend.